February 07, 2003

Nagano Prefecture) have jointly developed a printed wiring board for next-generation high-speed and high-density packages

the four companies listed above have been promoting the development of technology allowing higher semiconductor density and higher clock speed in various fields such as materials

equipment and process technologies were developed
however has now processed these resins using its own advanced technology for organic materials to develop insulating layer materials easily processed using a UV laser micro via technique
*These values ​​represent results achieved

as well as plasma treatment and plasma metal deposition systems able to form fine thin-films directly on BCB resins without causing any deterioration in their material properties

The two companies will now promote the development of sophisticated technologies for the realization of a f30µm micro via and LS=15/15µm

will establish a mass production system for these products to market them


the company has been developing the ASTOB (Advanced Super Thin Organic Board) and F3s (Fine For Flip-chip Substrate) and producing these products on an increased scale aimed at the CSP and MCM markets

Contact:
슈키치 타키
General Manager of Research & Development Dept
Shinko Co., Ltd.
Tel/+81-265-79-1811 Fax /+81-265-79-1362
mailto:Shuukichi_Takii@el